Ceramic Substrate

Application:

Due to the increasing the requirements of electronic components for power consumption today, the application of ceramic circuit boards as the best heat dissipation is also gradually increasing.Because ALN has some features, including excellent heat dissipation, corrosion resistance and coefficient of thermal expansion close to that of silicon wafers, it becomes the best material for high-power electronic components.








Process Capability
  ALN Al2O3
Depth(mm) 0.1~10 0.1~10
Size(mm) 1~450 1~450
TTV(um) <5 <5
Surface roughness(Ra) Min 0.01um Min 0.01um