Ceramic Substrate
Application:
Due to the increasing the requirements of electronic components for power consumption today, the application of ceramic circuit boards as the best heat dissipation is also gradually increasing.Because ALN has some features, including excellent heat dissipation, corrosion resistance and coefficient of thermal expansion close to that of silicon wafers, it becomes the best material for high-power electronic components.
Process Capability
ALN | Al2O3 | |
Depth(mm) | 0.1~10 | 0.1~10 |
Size(mm) | 1~450 | 1~450 |
TTV(um) | <5 | <5 |
Surface roughness(Ra) | Min 0.01um | Min 0.01um |