Glass Wafer

Description:
Fan-Out Wafer Level Packaging (FO-WLO) has become mainstream now. In the 2.5D and 3D packaging process, in order to eliminate the warpage in the packaging, it is necessary to use glass wafers that can match the coefficient of thermal expansion of the silicon wafers.

Longhao focuses on manufacturing semiconductor quartz glass mask blanks. We have the mask-level flatness and smoothness production capabilities and complete production equipment from materials to finished products. We have accumulated many years of mass production performance. Now we have developed the new glass substrates for semiconductor advanced packaging applications.

1. The size range is from 6 inches to 12 inches.

2. The coefficient of thermal expansion : 3 ppm/°C ~ 12 ppm/°C

3. The thickness of the glass wafer is from 0.5mm to 2 mm.

4. Less than 3um Total thickness difference (TTV)